Simplify the design of vehicle body controller by integrating CAN FD and LIN transceivers in the power management IC of Italian semiconductor car regulations

    The integrated power supply and transceiver on chip help simplify the design of the body controller, suitable for sunroof, seats, tailgate, doors, and lighting modules. These controllers have excellent applicability and are also suitable for gateways, HVAC controllers, keyless entry systems, remote information processing control units, and control panels.

    In the existing products of this series, SPSB081C3 and SPSB081C5 respectively include a 3.3V fixed voltage LDO regulator and a 5V fixed voltage LDO regulator, as well as a CAN transceiver. SPSB0813 and SPSB0815 also add a LIN transceiver. All series products have auxiliary LDO regulators, which can be set as independent 3.3V or 5V regulators or voltage trackers for the main LDO regulator through the on-chip SPI port. The maximum pulling current of the four high side drivers is 140mA, which can drive LEDs and sensors, providing current monitoring function and a 10 bit PWM timer for each channel.

    The entire series of products integrates various safety protection functions, providing diagnostic output pins required for fault safety signal systems. Even if not designed as a secure hardware unit, these functions can still meet the functional safety requirements of ISO 26262. All outputs have overcurrent protection and open load fault indication functions. The main LDO (fixed voltage) regulator has overvoltage protection and thermal protection circuits, while the auxiliary LDO (configurable) regulator has overload, overheating, short circuit, and reverse bias protection functions. Both voltage regulators have the functions of starting ground short circuit monitoring and continuous voltage regulator fault monitoring.

     The SPSB081 series complies with the AEC-Q100 automotive electronics standard, with a rated operating temperature range of -40 ° C to 150 ° C and a maximum operating temperature of 175 ° C. All products in the entire series have been put into mass production and are packaged in 5mm x 5mm x 1mm QFN32L with improved thermal performance.