The Third China Integrated Circuit Design Innovation Conference and Wuxi IC Application Expo (ICDIA 2023) will be held in Wuxi in July, leading the high-quality development of the integrated circuit industry by applications
Time:2023-07-07
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From July 13th to 14th, sponsored by the China Integrated Circuit Design Innovation Alliance, Wuxi National High tech Industrial Development Zone Management Committee, and the National "Xinhuo" Innovation Base (Platform), Wuxi National Integrated Circuit Design Base Co., Ltd., Wuxi National "Xinhuo" Innovation Base (Platform), Xinmaitong Exhibition Technology Development (Wuxi) Co., Ltd., and Shanghai Xinxingjian Conference Services Co., Ltd The "Third China Integrated Circuit Design Innovation Conference and Wuxi IC Application Expo (ICDIA 2023)" organized by the China Integrated Circuit Magazine is about to be held grandly in Wuxi. The conference focuses on the theme of "Application leads the high-quality development of the integrated circuit industry", highlighting "innovation" and "application", focusing on the ecological construction of the IC industry chain, promoting collaborative innovation between design and application, strengthening close cooperation between upstream and downstream of the industry chain, and promoting the industrialization of innovative achievements. Over the past two years since the ICDIA Innovation Conference was held, it has established an information platform for national integrated circuit enterprises, information and communication enterprises, universities, research institutes, user units, alliance organizations, and investment institutions to exchange and discuss cooperation with each other, with over 2000 attendees.
With the increase of chip scale and the advancement of process technology, chip design is becoming increasingly challenging. As the design of any product revolves around the end market, every change in the end application market will become a source of innovation. Although the industry will be in a cyclical downward trend in 2023 due to the weak demand for mobile phones, tablets, PCs and other consumer electronic terminals, the industry will seek change in the opposite direction. The "lack of core" of cars starting at the end of 2020, the outbreak of big language AI models represented by ChatGPT at the end of 2022, the intelligent upgrading and transformation of traditional industries by Artificial intelligence of things (AIoT), and the vigorous development of automatic driving will create a wide market for various applications, Bringing rare innovation opportunities to the upstream IC design industry.
Based on these emerging terminal application markets, ICDIA 2023 has set up six special forums, namely "Automotive Electronics and Applications", "Intelligent and Autonomous Driving", "IC Design and Applications", "Communication and Mobile Interconnection", "AIoT and ChatGPT", and "Home Appliance Integrated Circuit Application Seminar". The top representative enterprises in the six application fields will focus on the current development status and trends of China‘s automotive chip industry, chip solutions for future electronic architecture The development and challenges of power terminal control chips, as well as the design of integrated circuits for radio frequency and optoelectronic communication, have been discussed to explore how application requirements can lead to IC design innovation. Currently, more than 100 exciting reports have been collected.
Ye Tianchun, Chief Engineer of National 02 Special Technology and Vice President and Secretary General of China Integrated Circuit Innovation Alliance, Wei Shaojun, Chief Engineer of National 01 Special Technology and President of China Integrated Circuit Design Innovation Alliance, Yin Shouyi, Vice President of School of Integrated Circuits of Tsinghua University, Tan Lei, Deputy General Manager of Simbond Microelectronics (Beijing) Co., Ltd., Wang Ye, Vice President of Haier Zhijia Co., Ltd., and Zhang Chunhui, CEO of Zebra Zhixing, Xiaohu Yu, director of the State Key Laboratory of Mobile Communications of Southeast University, Wang Yubo, deputy general manager of Beijing Smartchip Microelectronics Co., Ltd. and other industry leaders will bring wonderful theme reports to the conference, sharing innovation opportunities in six application fields of AI architecture, analog devices, automobile, consumer electronics, Internet, mobile communications and power electronics.
Leading companies in the IC industry, such as Xin Yaohui, Anmou Technology, Hejian Industrial Software, Sunrise, Xingxin Technology, Gubo Technology, China Home Appliance Academy, Huadeng International, and CR Micro, will also share the future trends and innovative achievements of the IC industry. Over 2000 professional viewers will participate in the exchange. At present, the complete conference schedule for ICDIA 2023 has been officially released. Scan the QR code to view the complete agenda and register:
As one of the important highlights of this ICDIA conference, more than 100 innovative Chinese chip companies have been organized to showcase their latest products and technologies through the "IC Application Exhibition", including the "Core Fire" innovation platforms (ICC) in Beijing, Shenzhen, Hangzhou, Wuxi, Nanjing, Chengdu, Hefei, Tianjin, etc., the Songshan Lake Domestic IC Innovation Forum, and the Dishui Lake RSIC-V Innovation Forum.
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