Semiconductor equipment leader Fanlin announces the world‘s first crystal edge deposition solution

Source: Compiled by Global Semiconductor Watch

    Recently, semiconductor equipment leader Fanlin announced the launch of the world‘s first crystal edge deposition solution, Coronaus DX, aimed at addressing key process challenges in next-generation logic chips, 3DNAND, and advanced packaging applications.

    It is reported that Coronaus DX can deposit a special protective film on the edge of the wafer, which helps reduce defects and damage that often occur in advanced semiconductor manufacturing and improve chip yield.

    Sesha Varadarajan, Vice President of Fanlin, stated that Coronas DX helps achieve predictable manufacturing and significantly improves yield. This technology can be used for the production of advanced chips, semiconductor packaging, and 3DNAND storage chips, while reducing the cost of advanced process chips.