Micron announced the shipment of the world‘s first 232 layer TLC NAND chip

Source: it home

    On July 26, micron announced today that it has begun mass production of the world‘s first 232 layer NAND. Compared with previous generations of micron NAND, it has the highest areal density in the industry and provides higher capacity and higher energy efficiency.

    Scott DeBoer, executive vice president of micron technology and products, said, "micron‘s 232 layer NAND is a watershed for storage innovation, which has proved for the first time the production capacity of expanding 3D NAND to more than 200 layers."

    Officials said that micron‘s 232 layer NAND technology achieved the fastest NAND i/o speed in the industry: 2.4 GB per second, 50% faster than micron‘s 176 layer NAND. Meguiar‘s 232 layer NAND achieved the highest TLC density per square millimeter ever: 14.6 gb/mm2. 232 layer NAND is delivered in a new 11.5mm x 13.5mm package, and its package size is 28% smaller than that of previous generations of micron products. Micron 232l TLC NAND is called b58r, with a single die capacity of 1TB. It can realize 2TB capacity in a single chip package in 16*die package.

    It is understood that micron‘s 232 layer NAND has been mass produced in the company‘s Singapore factory and will initially be delivered to customers in the form of components through the crucial inrida SSD consumer product line.

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