Dpa Group launches automotive thermal management solutions based on Infineon products
Time:2024-05-29
Views:144
Source: General Assembly Author: General Assembly
On May 9, 2024, DDA Holdings, a leading international distributor of semiconductor components in the Asia-Pacific region, announced that its Pinka unit has launched an automotive thermal management solution based on Infineon‘s Aurix TC334 chip.
Figure 1- Display board of Infineon‘s automotive thermal management solution
With the green transformation and technological innovation in the global automotive industry, vehicle thermal management systems have become a key factor in improving energy efficiency and ride comfort. Compared with traditional fuel vehicles, new energy vehicles have more complex and demanding requirements for thermal management systems. Electric and hybrid vehicles not only need to manage the temperature of the engine, but also ensure that the battery pack, electric motor and power electronics are in the optimal temperature range to maintain performance and extend service life. In this context, the Infineon Aurix TC334 MCU launched the automotive thermal management solution, which can monitor and manage the temperature changes of automotive components in real time, so that they are always within the appropriate temperature range.
Figure 2- Scenario application diagram of automotive thermal management solution based on Infineon products
This solution is based on Infineon Aurix TC334 MCU as the core, equipped with TLE9271QX PMIC/SBC chip, TLE94112ES multichannel half-bridge IC, BSP726T and BSP75N intelligent power switches, 74HC4051 analog switches and other products. Among them, Aurix TC334 MCU is Infineon AURIX? The second generation MCU products of the series use a high-performance six-core architecture, with excellent real-time performance, functional safety level up to ASIL-D, and integrated information security hardware encryption module and powerful interconnection interface within the device, suitable for many automotive applications.
Figure 3- Block diagram of automotive thermal management solution based on Infineon products
The excellent performance and reliability of this scheme can quickly help users to complete the development and design of thermal management system. Thanks to the excellent performance of the device, the solution can intelligently adjust the temperature of the vehicle according to the operating condition of the vehicle and the change of the external environment, so as to indirectly protect the dynamic performance and economic performance of the vehicle.
Core technical advantages:
Infineon Aurix TC334:
High-performance MCUS with lock-step cores based on TriCore 1.6.2.P;
Integrated DSP, FPU and other data processing units;
Rich peripherals, including QSP, CAN, ASCLIN, SENT and other communication interfaces;
Integrated Hardware Security Module (HSM) for data encryption, etc.
Integrated Security Management Unit (SMU) for security monitoring;
Functional safety level ASIL-D is supported.
Project specification:
Infineon Aurix TC334 MCU and TLE92XX series SBC;
Reserved SPI interface can communicate with external three-phase bridge driver or MCU to control BLDC;
The half-bridge drive with the Infineon TLE94112 integrated MOS can be used to control low-power brushed motors;
With Infineon BSP7 series high side switches for valve control;
12V voltage input, all I/O ports support 3V/5.5V drive;
Reserved sensor ports collect external environment information.
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