Relationship between cooling fan IC and current

Relationship between cooling fan IC and current

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Removing transmission line effects using FIR filters

The serial data output speed of the Network Serial Deserializer (SERDES) has reached as high as 28Gbps and continues to develop. At such high data rates, even s...

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5 Keys to LED Driver Design

To popularize LED lighting fixtures, it is not only necessary to significantly reduce costs, but also to solve technical problems. How to solve the challenges o...

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Principle of implementing audio signal detection

The frequency range that can be heard by the human ear is approximately 20 Hz to 20000 Hz. This range can include single tones, such as transformer buzzing or w...

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How to efficiently generate high-voltage power rails in automotive applications

Although 12V lead-acid batteries are still the mainstream of automotive power supply, there are also some new applications that require higher voltages, such as...

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Discuss the understanding of current ripple and its impact on current driven dev...

Ripple current or voltage refers to the higher-order harmonic components in the current, which can cause changes in the amplitude of the current or voltage, pos...

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Testing of Fever Sound Systems

Most audio enthusiasts have this experience: how come they feel good about recording at home but don‘t perform well when they receive it from someone else‘s h...

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The Harm and Avoidance Methods of PCB Fingerprint

Fingerprint "is a major scourge of PCBs and one of the main reasons for poor scrapping of PCBs and deteriorating reliability of end users. And almost every step...

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EMC issues - grounding techniques and precautions for PCB engineers

When laying the board, attention should also be paid to EMC suppression!! This is very difficult to grasp, distributed capacitors always exist!!

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The matter of RF wiring and ground

Let‘s give an example. We will conduct RF line simulation on multi-layer circuit boards. In order to make a better comparison, the simulated PCB will be divide...

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Layout considerations for synchronous step-down converters

The buck DC/DC converter (see Figure 1) is a very popular switch DC/DC voltage regulator topology, widely used in many electrical and electronic applications, ...

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The three key aspects of AR toys: technology, scenario, and content

Toy manufacturers must consider three factors when developing AR toys: technology, scenario, and content, all of which are indispensable. Apple is likely to inc...

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Application and Selection of Tantalum Capacitors in Power Supply Circuits

Tantalum capacitors have a wide operating temperature range, stable temperature characteristics, large specific capacity, and unique self-healing characteristi...

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Common Problems in the Application of Chip Resistors

In the modern electronic industry, chip resistors are often the most common internal devices in electronic products, but they are often overlooked by us, leadin...

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Ten highlights of Wearable technology

Although the wearable device market is not yet mature, it is still growing. Now there are about 160 types of wearable devices in the world, such as track tracki...

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Discussion on Mosfet Drive Circuit

MOSFETs are widely used in switching power supplies due to their low internal resistance and fast switching speed. The driver of MOSFETs often selects the appro...

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Model based design to improve the design efficiency of Functional safety of car ...

Today, with the rapid development of electrification, intelligence, and networking in automobiles, the number and types of chips used in automobiles are also in...

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Audio TDD

Since GSM shares 8 physical channels on each interval 200KHz channel, that is, 8 physical channels on the same frequency, that is, time division multiplexing fo...

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How to achieve low EMI in Class D audio amplifiers

Class D audio amplifiers often have EMI issues due to the presence of switching frequency. This article will introduce some methods to effectively reduce EMI of...

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How to solve the heat dissipation problem of electronic components

With the development of integration technology and microelectronic packaging technology, the total power density of electronic components continues to grow, whi...

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