X-FAB enhances its 180 nm car-to-gauge high voltage CMOS foundry solution
Time:2024-06-02
Views:112
Source: X-FAB Author: X-FAB
Beijing, China, May 21, 2024 - X-FAB Silicon Foundries (" X-FAB "), a globally recognized analog/mixed-signal foundry of excellence, today announced an update to its XP018 high-voltage CMOS semiconductor manufacturing platform. New 40V and 60V high voltage base devices added - these devices have a scalable SOA for increased operational robustness. The second generation of the updated high voltage base device has up to 50% lower RDSon resistance compared to the previous generation platform, providing a better choice for some critical applications - especially in systems that require smaller device sizes and lower unit costs.
The XP018 platform is a modular 180 nm high voltage EPI technology solution based on a low mask number 5V single gate core module that supports a wide temperature range from -40°C to 175°C. A range of devices and modules are available - including high-gain bipolar devices, standard and high-capacitance density MIM capacitors, multi-threshold (Vt) options, Schottky diodes and depletion devices.
The platform features highly reliable automotive NVM solutions, such as embedded Flash Memory (Eflash), EEPROM and OTP, and is designed for cost-sensitive and robust automotive, industrial and medical applications.
In addition to the new 40V/60V devices, the platform has added a 5.3V Zener diode to further enhance its performance. This new low leakage current Zener diode is designed to protect gate oxygen in critical applications, such as wide-gap gate driver applications. In addition, it offers a range of new isolated drain high voltage devices with voltages up to 24V and 1.8V MOS devices with mid-threshold voltage options.
Tilman Metzger, High voltage product line Manager at X-FAB, said: "This upgrade of our XP018 platform demonstrates X-FAB‘s commitment to strengthening proven technologies. The XP018 platform has been in production for more than a decade and is still widely used in new designs in our focused market segments such as automotive, industrial and medical. These highly competitive high-voltage devices and their updates will enable our customers to build more innovative and cost-effective products. "Designers using the new XP018 base device can get full PDK support from all major EDA platforms, including Cadence, Siemens EDA, Synopsys, and others, ensuring seamless integration and optimization across a wide range of applications."
The new medium threshold standard cell library is expected to be released in the third quarter of 2024. More detailed information about XP018 platform, please visit: https://www.xfab.com/technology/high-voltage
Abbreviations:
CMOS complementary metal oxide semiconductor
DMOS double diffused metal oxide semiconductor
PDK process design kit
RDSon On-resistance
SOA secure workspace
Silicon on SOI insulator
About X-FAB:
X-FAB is a leading analog/mixed-signal and MEMS foundry group that produces silicon wafers for automotive, industrial, consumer, medical and other applications. Using modular CMOS and SOI processes ranging in size from 1.0μm to 110nm, and featuring SiC and micro-electro-mechanical systems (MEMS) long life processes, X-FAB delivers the highest quality standards, manufacturing excellence and innovative solutions to customers worldwide. X-FAB‘s analog digital integrated circuits (mixed-signal ics), sensor MEMS are manufactured at six manufacturing sites in Germany, France, Malaysia and the United States, and employs approximately 4,500 people worldwide.
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