Italian semiconductor car gauge dual inline silicon carbide power module provides multifunctional packaging configuration

    Italian Semiconductor has released the ACEPACK1 DMT-32 series of automotive silicon carbide (SiC) power modules. The new series of products are packaged in convenient 32 pin dual inline through-hole plastic packaging, targeting automotive systems such as on-board chargers (OBCs), DC/DC transformers, oil pumps, and air conditioners. The product advantages include high power density, compact design, and easy assembly. It offers three packaging configurations: four tube full bridge, three-phase six tube full bridge, and totem pole, Enhanced system design flexibility.

    Due to the proven and robust ACEPACK packaging technology of Italian semiconductor, these modules reduce overall system and design development costs while ensuring excellent reliability. This packaging technology uses high-performance aluminum nitride (AlN) insulation substrate, which has excellent thermal performance. There is also an NTC temperature sensor inside the package that provides temperature monitoring information for the thermal protection mechanism.

    The M1F45M12W2-1LA launched this time is the first product of the ACEPACK DMT-32 series, which will begin mass production in the fourth quarter of 2023. The samples of M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, and M1P30M12W3-1LA have been available for mass production since the first quarter of 2024. The price depends on the product configuration.