Only one month to raise more than 30 billion yuan semiconductor industry recovery dawns

Source: Cailian News Agency

    After nearly a year of sharp decline in demand, the global semiconductor technology industry chain has been struggling to cut orders, haggle over prices, change contracts, and even make big profits to make losses. The dawn of recovery has finally emerged. In terms of financing, although the economic environment has not yet recovered, new financing in the field of chip semiconductors remains intensive. According to statistics from Semiconductor Engineering, a well-known semiconductor industry website, in February alone, at least 124 chip semiconductor related startups raised more than 30 billion yuan in total, of which at least 63 domestic startups received more than 7 billion yuan in new financing.

    The semiconductor industry expects that as inventory decreases and demand warms up, the supply chain will also warm up one by one based on its strength. Strong large factories will take the lead in shaking off the downturn and restarting growth momentum. In addition, as domestic work and life return to normal, and the second quarter enters the May Day and 618 shopping festivals, operator promotions, as well as government subsidies such as home appliances to the countryside and new energy vehicles, will be on the road, and terminal inventory is expected to accelerate the depletion. The pent-up domestic consumer demand is expected to erupt, and the semiconductor technology industry is expected to outperform expectations in the second half of the year.

    According to the subject database of Cailian News Agency, among the relevant listed companies:

    Yingtang Intelligent Control provides customers with R&D and manufacturing services for products including optoelectronic integrated circuits, optical sensors, display drive ICs, automotive ICs, MEMS micro galvanometers, and other products. Currently, its subsidiary Yingtang Micro Technology is placing orders for OEICs, display drive ICs, automotive ICs, and optoelectronic sensor components that have achieved mass sales.

    The chip advanced packaging and testing full process packaging and testing project of Tongxingda subsidiary is mainly applied to the display driver IC and CIS chip fields.