Shandong Dingmi semiconductor sealing test and intelligent terminal project is about to be put into trial operation
Time:2022-05-01
Views:2211
Source: Peony evening news all media
On April 28, with the equipment entering the site and the workshop decoration coming to an end, Shandong Dingmi semiconductor packaging and testing and intelligent terminal project will soon enter the trial operation stage. The project mainly plans to build a complete industrial chain from chip semiconductor design, packaging and testing to intelligent terminal manufacturing. It is understood that Hong Kong Dingmi technology is a large-scale high-tech enterprise specializing in the R & D, production and sales of consumer electronic terminal supporting products. It has the world‘s advanced production line for semiconductor device packaging and testing, and has established its own terminal brand. At present, it has the independent import and export right of the enterprise, with more than 100 patents. It signed and landed in Heze high tech Zone in December 2021.
Shandong Dingmi semiconductor packaging and testing and intelligent terminal project plans to build a complete industrial chain from chip semiconductor design, packaging and testing to intelligent terminal manufacturing. The chip products mainly designed and manufactured are widely used in the fields of household appliances, standard power supply, consumer electronics and industrial control.
Phase I uses 12000 ㎡ Industrial Park plant to engage in the production and manufacturing of chip semiconductor packaging and testing projects, and phase II uses 12000 ㎡ Industrial Park plant to engage in the production and manufacturing of intelligent terminal products. The project is committed to achieving breakthroughs in products, output value and scale with one-stop services and related supporting technical services in integrated circuit manufacturing.
Shandong Dingmi semiconductor packaging and testing and intelligent terminal project plans to build a complete industrial chain from chip semiconductor design, packaging and testing to intelligent terminal manufacturing. The chip products mainly designed and manufactured are widely used in the fields of household appliances, standard power supply, consumer electronics and industrial control.
Phase I uses 12000 ㎡ Industrial Park plant to engage in the production and manufacturing of chip semiconductor packaging and testing projects, and phase II uses 12000 ㎡ Industrial Park plant to engage in the production and manufacturing of intelligent terminal products. The project is committed to achieving breakthroughs in products, output value and scale with one-stop services and related supporting technical services in integrated circuit manufacturing.
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