The total investment completed in the first quarter was 2.14 billion yuan! Four major municipal projects of electronic information industry in Liangjiang New Area have achieved remarkable results

Source: Chongqing daily

    On April 18, the reporter learned from Liangjiang New Area that four major municipal projects in the electronic information industry, including BOE 6th generation AMOLED (flexible) production line project, BOE smart system innovation center, Otis semiconductor packaging carrier board and system level packaging printed circuit board upgrading project, Corning front melting furnace project, completed an investment of 2.14 billion yuan in the first quarter, with an investment progress of 33.1%.

    As a leading enterprise in the electronic information industry chain, BOE‘s two major projects under construction attract attention.

    Among them, BOE‘s 6th generation AMOLED (flexible) production line project, located in Shuitu new town, covers an area of about 970000 square meters. It officially announced mass production on December 28 last year. At present, it is promoting the subsequent equipment procurement and installation.

    It is understood that BOE‘s 6th generation AMOLED (flexible) production line is independently designed, developed and built by BOE. It adopts the world‘s leading active organic electroluminescent AMOLED technology for R & D and production. Its leading technology products and services will be widely used in the next generation of high-end display fields such as the new generation of flexible smart phones, foldable notebooks and on-board displays, so as to promote the upgrading of the whole industry in the direction of intelligence and digitization.

    BOE smart system innovation center, located in Lijia Yuelai smart Park, started construction in October 2020. After more than one year of construction, it is accelerating the construction of the main structure.

    It is expected that by June this year, the project will complete the construction of five platforms: software and hardware integration technology development, transformation of new materials and equipment, marketing promotion and exhibition of products and services, international talent exchange and training, open technology and market cooperation, and will be completed and put into operation within the year.

    At that time, the project will focus on smart retail, smart finance, industrial Internet, smart city public services and other fields, accelerate the gathering of advantageous resources of the national display and sensing industrial chain to the Chongqing market, realize the organic coupling of innovation chain and industrial chain, and enhance the ability of industrial technological innovation.

    The Otis semiconductor packaging carrier board and system level packaging printed circuit board upgrading project located in Yufu new city will be completed and put into operation in 2024 according to the schedule. At present, equipment procurement and installation are under way.

    The reporter learned that Otis is the largest manufacturer of high-end semiconductor packaging carrier boards and high-density interconnection printed circuit boards in Europe and the world‘s top. Its products are mainly used in mobile devices, and also widely involved in automotive, aerospace, industry, medical electronics, chips and other fields. Chongqing is one of the most important production bases in the world.

    Since 2011, Otis has continued to invest in high-tech and innovative technologies in Chongqing. In 2019, Otis announced that it would invest about 1 billion euros in Chongqing in the next five years to build a new factory to meet the growing global demand for semiconductor packaging carrier technology for high-performance computing applications. In March 2021, Otis added about 200 million euros to expand the semiconductor packaging carrier business of Chongqing factory.

    The upgrading project of aotes semiconductor packaging carrier board and system level packaging printed circuit board will be completed and put into operation in 2024 and will be fully put into production, which will strongly promote aotes to obtain greater market share in the field of mainstream carrier technology.

    Corning front section furnace project is located in Shuitu new town and started construction in August last year. The main steel structure of the main plant has been capped according to the node on December 29, 2021. At present, the construction of secondary structure, peripheral protective structure, decoration and procurement and installation of 52 subsystems of 12 major systems of electromechanical equipment are under way.

     It is understood that the front section of Corning furnace project has a total land of about 146 mu, a total construction scale of about 126000 square meters, and a planned investment of more than 1.4 billion US dollars.

    Among them, phase II (glass substrate melting furnace production line project) will build four 8.5 generation and above display glass substrate front section melting and forming production lines, and phase III (Gorilla glass melting furnace project) will build two cover glass melting furnace production lines.

    It is worth mentioning that the gorilla glass project will provide durable and optical cover glass for mobile devices such as smartphones, tablets and notebooks. At present, more than 8 billion sets of equipment of more than 45 well-known brands in the world have used Corning gorilla glass. After the project is completed and put into operation, it plays an important role in promoting the supplement, extension and strengthening of the electronic information industry in Liangjiang New Area and Chongqing, and enhancing the toughness and competitiveness of the industrial chain supply chain.

Disclaimer: This article is transferred from other platforms and does not represent the views and positions of this site. If there is infringement or objection, please contact us to delete. thank you!     矽源特科技ChipSourceTek