Heyan technology completed round B investment and assisted in the localization of semiconductor cutting equipment
Time:2022-04-16
Views:2210
On April 14, Shenyang Heyan Technology Co., Ltd. (hereinafter referred to as "Heyan technology") recently completed the latest round of round B financing, involving 12 institutions. This round of financing is jointly invested by Ginkgo Valley capital, Shilan venture capital, Walden International, Chaoyue Moore fund, Yuanhe Puhua, Weihao Chuangxin, Jinpu investment, TEDA ketou, xingorange capital, Su Gaoxin financial holding and Zhenghai assets, and quandexue capital, the shareholder of round a, continues to invest.
It is understood that this round of financing funds will be mainly used for the R & D of high-end automatic series products, the release of production capacity of 12 inch precision dicing machine and the construction of new product projects of Suzhou subsidiary. The investors have invested deeply in the semiconductor industry for many years. They will introduce rich customer resources for Heyan technology, provide opportunities for talent exchange and technical cooperation, and help Heyan technology to realize the localization and substitution of semiconductor dicing equipment.
Founded in 2011, Heyan technology is a national high-tech enterprise specializing in the R & D, production, sales and service of semiconductor precision cutting equipment. At present, the company has formed 6-inch, 8-inch and 12 inch automatic precision dicing machines, jigsaw automatic cutting and sorting integrated machines and other core products, which are widely used in precision dicing of hard and brittle materials in many fields such as integrated circuits, discrete devices, optoelectronic devices, sensors, optical communication devices, optical components, medical electronics and so on. With the excellent performance and reliability of the products, At present, it has been listed as the core supplier of cutting equipment by many mainstream semiconductor packaging enterprises.
It is understood that this round of financing funds will be mainly used for the R & D of high-end automatic series products, the release of production capacity of 12 inch precision dicing machine and the construction of new product projects of Suzhou subsidiary. The investors have invested deeply in the semiconductor industry for many years. They will introduce rich customer resources for Heyan technology, provide opportunities for talent exchange and technical cooperation, and help Heyan technology to realize the localization and substitution of semiconductor dicing equipment.
Founded in 2011, Heyan technology is a national high-tech enterprise specializing in the R & D, production, sales and service of semiconductor precision cutting equipment. At present, the company has formed 6-inch, 8-inch and 12 inch automatic precision dicing machines, jigsaw automatic cutting and sorting integrated machines and other core products, which are widely used in precision dicing of hard and brittle materials in many fields such as integrated circuits, discrete devices, optoelectronic devices, sensors, optical communication devices, optical components, medical electronics and so on. With the excellent performance and reliability of the products, At present, it has been listed as the core supplier of cutting equipment by many mainstream semiconductor packaging enterprises.
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