Promote the linkage of the entire chip machine, ICDIA will meet you in Wuxi in July!
Time:2023-07-09
Views:837
The Third China Integrated Circuit Design Innovation Conference and Wuxi IC Application Expo (ICDIA 2023) will be held in Wuxi from July 13th to 14th. This conference specially invites numerous heavyweight guests who are deeply involved in the fields of EDA and IP, IC design, testing, manufacturing, automotive electronics, AIoT, whole vehicles and components, to jointly explore how new trends in future application development can lead the high-quality development of the integrated circuit industry. At present, the complete conference schedule and summary of speeches by heavyweight guests at the summit forum have been announced. For more cutting-edge IC application cases, please look forward to the exciting content at the conference site and exhibition area.
Special topic on automotive electronics: Promoting the integration of supply and demand for automotive chips, and the "Reliability Classification Catalogue for Domestic Automotive Chips (2023)" is about to be released
For the automotive electronics field, from July 13 to 14, at the "10th Automotive Electronics Innovation Conference (AEIF 2023)" held at the same time, from the National New Energy Innovation Center, United Automotive Electronics, Huada Semiconductor, Qipuwei, ADI, Centric, Keysight Technology, Bosch, Shanghai Automotive Chip Engineering Center, Centric Intelligence, Siemens EDA, Xiaohua Semiconductor, Ruicheng Microelectronics, Zhongke Saifei, proteanTecs, Cadence, Amkor Technology Technical experts from the industry, university and research circles of Howei Group, Yen Star Technology, Hejian, Tongji University, Kangzhi Integrated Circuit, Geely Auto Automobile, Shinhara, Renesas Electronics, InBev Supercomputing, Jiangnan University will focus on "the current situation of China‘s automobile chip industry", "the current situation and trend of the car size semiconductor supply chain", "the breakthrough path of new energy vehicle battery and electric drive chip technology", "the full scene car size chip" Sharing topics such as "Automotive Chip Testing Methods", "Contribution of Automotive Power Semiconductors to Reducing Carbon Emissions", "Difficulties in Mass Production of L3 Autonomous Driving and Safety Assurance of L2+Intelligent Driving".
Reliability Classification Catalogue for Domestic Vehicle Specification Chips (2023)
On the afternoon of July 13, at the "Auto Chip Supply and Demand Matchmaking Meeting", Chan Tah Wei, the deputy chief engineer of China Electronics Technology Standardization Research Institute, will make an in-depth interpretation of the Reliability Classification Catalog of Domestic Car Gauge Chips (2023) (hereinafter referred to as the Catalog). Huada Semiconductor, Qipuwei, Jiefa Technology, Xinwangwei, Kangzhi Integrated Circuit, Xinlite, Fudan Micro, Suzhou Guoxin Technology, Lingxin, Threep, Xinqing Technology, Feixian Intelligent, Heizhi, Shanghai Hisense and other outstanding automobile chip manufacturers who have been included in the Catalog will hold roadshows with Bosch, Wuhu Bethel, Junsheng Automobile Safety System, Dongfeng Motor, Ford Motor, Geely, Weilai, SAIC, Foton Motor The engineer representatives responsible for procurement and hardware development of Great Wall Motor, Smart Motor and other vehicle and component manufacturers conduct supply and demand docking. Shanghai Huizhong Automobile will also serve as a vehicle representative to introduce its domestic application of automotive chips at the docking meeting.
Special Topic on IC Design and Application: EDA, IP, IC Design Innovation Helps Challenge Large Scale Chip Design in the Post Moore Era
At the IC Design and Application Forum, representatives of EDA, IP, design and system manufacturers such as Boyuewei, Cadence, Siemens EDA, Xin Yaohui, Anmou Technology, Hejian Industrial Software, Xingxin Technology, Silian, 21Vianet, Zhixin Micro, Alibaba Cloud Cloud, Hongxin Wena, Guoweixin, Jingwei Qili, Yuanfang chips will discuss "the value of IC design platform in the era of advanced technology and large chips" "EDA system simulation boosts large-scale chip design reform", "edge computing reform, exploring new boundaries of terminal computing power", "automotive electronic system architecture design cases", "power terminal control chip development and challenges", "cutting-edge technology for timing sign off of ultra large-scale chips under advanced technology", "opportunities and challenges of ultra linear development of semiconductor technology to domestic EDA", "3DIC innovation" and other cutting-edge topics.
Special topic on communication and mobile interconnection: Analyzing the challenges and opportunities of UWB chips, 5.5G passive IoT chips, and integrated storage and computing chips
At the special forum on communication and mobile interconnection, for the incremental markets in mobile communication fields such as ultra wideband (UWB) device testing, reconfigurable high-frequency phased array Beamforming chip, radio frequency and optoelectronic communication integrated circuit, 5.5G passive Internet of Things chip, 5G terminal chip, memory and computing integrated chip, NI, crystal quasi communication, Southeast University, Zhihui Xinlian, UNISOC Experts from the Institute of IoT Technology and Application at China Mobile Research Institute will also share their exciting viewpoints.
AIoT and ChatGPT Special Topic: Small Capacity Storage, Reconfigurable Computing Architecture, High Performance Transformer, Storage and Computing Integration Leading the AI Big Model Computing Revolution
Faced with the generative AI field represented by ChatGPT, as well as the AIoT field that integrates the Internet of Things, this ICDIA 2023 conference has dedicated special topics on AIoT and ChatGPT. At that time, senior executives from Yanghe Yang Microelectronics, Qingwei Intelligence, Aixin Yuanzhi, Xinyuan Co., Ltd., Xinhuazhang, Zhicun Technology, Yizhu Technology, Tiantian Zhixin, Lingsi Intelligence, and Shihai Xintu will discuss topics including "small capacity storage", "reconfigurable computing architecture innovation", "Transformer large model end landing platform", "high-performance Transformer inference", "AIGC era storage and computing integration", "RRAM storage and computing integration" Numerous hot topics such as "new generation human-computer interaction" and "DRAM memory chips" are worth looking forward to!
IC application exhibition showcases cutting-edge technologies and innovative products
In addition to the cutting-edge reports from the Summit Forum and thematic forums covering various application fields, over 100 innovative Chinese chip companies will gather at the IC Application Exhibition, showcasing cutting-edge technologies and innovative products covering artificial intelligence, automotive electronics, consumer electronics, 5G, packaging testing and other application fields. Up to now, the confirmed exhibitors and institutions include Shenzhen Xinhuo, Wuxi Xinhuo, Hangzhou Xinhuo, Beijing Xinhuo, Hefei National "Xinhuo" Innovation and Entrepreneurship Platform, Chengdu Xinhuo, Tianjin Xinhuo, Nanjing Xinhuo, Jiangyin Integrated Circuit Design Innovation Center, Gubo Technology, Hejian Industrial Software, Huada Semiconductor, Xin Yaohui, YenStar Technology, Xingxin Technology, Silxin, Keysight, Anmou Technology, SAIC Motor, Weilai Technology Niuxin, Yilai Storage, Xinliancheng, Zhijuxinlian, SGS Tongbiao, Junjian Technology, Fudan Micro, Lingxin Technology, Xinlite, Silvaco, Zhongke Saifei, Feixian Intelligent, IEEE, Hongxin Nano, Alphawave SEMI, Sipake, Shengke Nano, Core Interconnection, Mengxin Technology, Lingxi Technology, Zhaoguan Technology, Lingsi Intelligent, Qingwei Intelligent, Hengxin Micro, Bailong Electronics, Xinsheng Electronics, Mixin Micro, Deyi Micro, Zhongguancun Core Park Jing Wei Qi Li, Guang Li Wei, An Qin, Su Shi Technology, Guo Xin Technology, Xuan Ji Xing Yuan, Kai Ling Technology, He Xin Micro, Yake Hongyu, Nai Xin Technology, Teng Xin Micro, Si Ruipu, Kang Zhi, Zi Guang Guo Xin, proteanTecs, Rui Cheng Xin Micro, Jie Fa Technology, Xin Wang Micro, Zhongke Yinhe Xin, An Bixuan, Mo Elite, Guo Wei Xin, Youxun, Qi Pu Wei, etc. In addition, this year‘s ICDIA 2023 exhibition features three exhibition areas: Wuxi IC Design Exhibition Area, Domestic Innovation IC Exhibition Area, and RISC-V Innovation IC Exhibition Area. These areas include Niuruixin, Zhongke Fusion, Maisike, Sitan Technology, Taisiwei, Gekong Technology, Shihai Xintu, Every Moment of Reflection, Zhicun Technology, Xinchi Group, Qiying Tailun, Xianji Semiconductor, Shiqing Technology, Zhongke Haoxin, Suneng, China RISC-V Industry Alliance CRVIC, Xinsheng Technology, Tailingwei Epot Strong will also make an exciting debut.
For more in-depth observations and reports on the semiconductor industry, please pay attention to Chip Insights, a WeChat account of Intel.
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